CHIP COLLECTION AIMS AT 1.9-GHZ DECT APPLICATIONS

被引：0
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作者：
不详
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来源：
MICROWAVES & RF | 1993年 / 32卷 / 03期
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暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
DESIGNERS of Digital European Cordless Telecommunications (DECT) systems never had it so easy. A silicon chipset from National Semiconductor (Santa Clara, CA) provides many of the DECT transceiver functions on four low-power, low-cost integrated-circuit (IC) chips. The chips, capable of efficient +3-VDC operation, are ideal for handsets as well as base stations.
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页码：173 / 173
页数：1
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