INFLUENCE OF GRAIN-BOUNDARIES ON THE LOW-TEMPERATURE THERMAL-CONDUCTIVITY OF COPPER

被引：0
|
作者：
GROGER, V
机构：
来源：
CRYSTAL LATTICE DEFECTS | 1979年 / 8卷 / 02期
关键词：
COPPER METALLOGRAPHY - Microstructures;
D O I：
暂无
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
Grain boundary scattering of electrons in copper foils is investigated experimentally by measurements of thermal conductivity. The Mayadas and Shatzkes model for electrical conduction describing electron scattering by grain boundaries and surface with a grain boundary reflection coefficient R and a surface scattering coefficient p is useful in this case. The influence of grain boundary scattering in foils of thicknesses between 12,5 mu m and 125 mu m was of the same order of magnitude as the size effect. Thermal conductivity is less decreased by grain boundaries than electrical conductivity.
引用
收藏
页码：69 / 72
页数：4
相关论文
共 50 条
12345