CHIP CORROSION IN PLASTIC PACKAGES

被引：16
|
作者：
BERG, HM
PAULSON, WM
机构：
来源：
MICROELECTRONICS AND RELIABILITY | 1980年 / 20卷 / 03期
关键词：
D O I：
10.1016/0026-2714(80)90204-8
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：247 / 263
页数：17
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