FUNDAMENTAL MECHANISMS OF TITANIUM NITRIDE FORMATION BY DC MAGNETRON SPUTTERING

被引:12
|
作者
RICHTER, F
KUPFER, H
GIEGENGACK, H
SCHAARSCHMIDT, G
SCHOLZE, F
ELSTNER, F
HECHT, G
机构
来源
SURFACE & COATINGS TECHNOLOGY | 1992年 / 54卷 / 1-3期
关键词
D O I
10.1016/0257-8972(92)90185-D
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The dependences of the structure and properties of titanium nitride layers deposited using reactive d.c. magnetron sputtering on the substrate bias voltage and substrate position were investigated. The plasma parameters and particle fluxes towards the substrate surface were analysed using in-situ methods. The microstructure of the layers as well as important properties strongly depend on the impact of energetic particles on the surface of the growing film. The formation of the TiN compound, on the contrary, depends mainly on the neutral atomic and excited molecular nitrogen species arising within the magnetron discharge.
引用
收藏
页码:338 / 342
页数:5
相关论文
共 50 条
  • [21] Process simulation of reactive DC magnetron sputtering for thin film deposition of niobium-titanium nitride
    Maezawa, H
    Sato, T
    Noguchi, T
    IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2005, 15 (02) : 3520 - 3523
  • [22] Copper nitride films deposited by dc reactive magnetron sputtering
    K. Venkata Subba Reddy
    A. Sivasankar Reddy
    P. Sreedhara Reddy
    S. Uthanna
    Journal of Materials Science: Materials in Electronics, 2007, 18 : 1003 - 1008
  • [23] Aluminum nitride layers prepared by DC/RF magnetron sputtering
    Mednikarov, B
    Spasov, G
    Babeva, T
    JOURNAL OF OPTOELECTRONICS AND ADVANCED MATERIALS, 2005, 7 (03): : 1421 - 1427
  • [24] Deposition of tantalum nitride thin films by DC magnetron sputtering
    Kim, SK
    Cha, BC
    THIN SOLID FILMS, 2005, 475 (1-2) : 202 - 207
  • [25] Characterisation of zirconium nitride coatings prepared by DC magnetron sputtering
    Ramana, JV
    Kumar, S
    David, C
    Ray, AK
    Raju, VS
    MATERIALS LETTERS, 2000, 43 (1-2) : 73 - 76
  • [26] CONTROL OF REACTIVE DC PLANAR MAGNETRON SPUTTERING OF CHROMIUM NITRIDE
    FABIS, PM
    SURFACE & COATINGS TECHNOLOGY, 1992, 52 (03): : 243 - 250
  • [27] Copper nitride films deposited by dc reactive magnetron sputtering
    Reddy, K. Venkata Subba
    Reddy, A. Sivasankar
    Reddy, P. Sreedhara
    Uthanna, S.
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2007, 18 (10) : 1003 - 1008
  • [28] Titanium nitride - Silicon nitride composite coatings deposited by reactive magnetron sputtering
    Patscheider, J
    Diserens, M
    Levy, F
    TRENDS AND NEW APPLICATIONS OF THIN FILMS, 1998, 287-2 : 267 - 267
  • [29] Hydrogenated amorphous silicon nitride deposited by DC magnetron sputtering
    Mokeddem, K.
    Aoucher, M.
    Smail, T.
    SUPERLATTICES AND MICROSTRUCTURES, 2006, 40 (4-6) : 598 - 602
  • [30] Aluminum nitride coatings by reactive pulsed dc magnetron sputtering
    Moran, MB
    Johnson, LF
    WINDOW AND DOME TECHNOLOGIES AND MATERIALS VII, 2001, 4375 : 300 - 306