BONDING AND ADHESIVE FILMS

被引:0
|
作者
GULYAEVA, VV
机构
来源
RUSSIAN ENGINEERING JOURNAL | 1978年 / 58卷 / 07期
关键词
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:47 / 49
页数:3
相关论文
共 50 条
  • [21] Adhesive wafer bonding
    Niklaus, F
    Stemme, G
    Lu, JQ
    Gutmann, RJ
    JOURNAL OF APPLIED PHYSICS, 2006, 99 (03)
  • [22] The Effect of the Different Teflon Films on Anisotropic Conductive Adhesive Film (ACF) Bonding
    Zhang, Jun
    Lin, Y. C.
    Huang, Liugang
    2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008, : 1082 - +
  • [23] THE USE OF ACETYLENE GLOW-DISCHARGE FOR IMPROVING ADHESIVE BONDING OF POLYMERIC FILMS
    MOSHONOV, A
    AVNY, Y
    JOURNAL OF APPLIED POLYMER SCIENCE, 1980, 25 (05) : 771 - 781
  • [24] Adhesive and conductive adhesive flip chip bonding
    Zenner, Robert L.D.
    Connell, Glen
    Gerber, Joel A.
    Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, 1997, : 117 - 119
  • [25] Adhesive and conductive adhesive flip chip bonding
    Zenner, RLD
    Connell, G
    Gerber, JA
    3RD INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS - PROCESSES, PROPERTIES, AND INTERFACES - PROCEEDINGS, 1997, : 117 - 119
  • [26] Structural bonding tape: An innovation in adhesive bonding
    Bennett, G
    Klingen, J
    Geiss, PL
    Neeb, T
    ADHESIVES AGE, 1996, 39 (10): : 19 - 23
  • [27] Adhesive bonding instead of welding: Vibrations and adhesive bonding - Do these fit together at all?
    Wegmann, Anton
    CIT Plus, 2024, 27 (03) : 44 - 45
  • [28] Design of the composite sandwich panel of the hot pad for the bonding of large area adhesive films
    Yoon, Soon Ho
    Lee, Dai Gil
    COMPOSITE STRUCTURES, 2011, 94 (01) : 102 - 113
  • [29] Aluminium-Nitride Thin-Films On Polymer Substrates Obtained by Adhesive Bonding
    Azrak, Edy
    Michaud, Laurent G.
    Reinhardt, Alexandre
    Tardif, Samuel
    Bousquet, Marie
    Vaxelaire, Nicolas
    Eymery, Joel
    Fournel, Frank
    Montmeat, Pierre
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2021, 10 (06)
  • [30] Surface pretreatment for adhesive bonding of aluminum with adhesive mediator
    Anagreh, N
    Dorn, L
    MATERIALWISSENSCHAFT UND WERKSTOFFTECHNIK, 2003, 34 (06) : 555 - 563