AN EXPERIMENTAL HIGH-DENSITY DRAM CELL WITH A BUILT-IN GAIN STAGE

被引:8
|
作者
KIM, W
KIH, J
KIM, G
JUNG, S
AHN, G
机构
[1] Department of Electronics Engineering, Seoul National University, Seoul
[2] Department of Electronics Engineering, Seoul National University, Hyundai Electronics Industries Co. Ltd., Kyungki-do, Seoul
关键词
D O I
10.1109/4.297707
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A new high-density DRAM cell concept is proposed and experimentally demonstrated. This cell, composed of two transistors and one capacitor, generates a large bit line signal with a small cell capacitance during the read cycle. Since it does not need a large storage capacitance and one transistor is stacked on the top of the other transistor, the cell size is small and can be easily scaled down for future generations of memory devices. The unit cell size fabricated using a 4 M SRAM process without any process modification is 1.8 mum x 2.85 mum. The proposed cell can be adopted to store multi-bit information. The fabricated prototype cell shows a resolution of about 3.5 bit.
引用
收藏
页码:978 / 981
页数:4
相关论文
共 50 条
  • [1] A high-density DRAM cell with built-in gain stage
    Kamoulakos, G
    Tsiatouhas, Y
    Chrisanthopoulos, A
    Arapoyanni, A
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2001, 48 (06) : 1194 - 1199
  • [2] A FERROELECTRIC DRAM CELL FOR HIGH-DENSITY NVRAMS
    MOAZZAMI, R
    HU, CM
    SHEPHERD, WH
    [J]. IEEE ELECTRON DEVICE LETTERS, 1990, 11 (10) : 454 - 456
  • [3] BUILT-IN SELF-REPAIR CIRCUIT FOR HIGH-DENSITY ASMIC
    SAWADA, K
    SAKURAI, T
    UCHINO, Y
    YAMADA, K
    [J]. PROCEEDINGS OF THE IEEE 1989 CUSTOM INTEGRATED CIRCUITS CONFERENCE, 1989, : 773 - 776
  • [4] Proposal of a logic compatible merged-type gain cell for high-density embedded DRAM's
    Mukai, M
    Hayashi, Y
    Komatsu, Y
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1999, 46 (06) : 1201 - 1206
  • [5] High-Density DRAM Package Simulation
    Wan, Ng Hong
    [J]. PROCEEDINGS OF THE 2012 IEEE 14TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2012, : 700 - 704
  • [6] Built-in parasitic-diode-based charge injection technique enhancing data retention of gain cell DRAM
    Chung, Yeonbae
    Cheng, Weijie
    Das, Hritom
    [J]. ELECTRONICS LETTERS, 2015, 51 (23) : 1854 - 1855
  • [7] A facile periodic porous Au nanoparticle array with high-density and built-in hotspots for SERS analysis
    Liu, Guangju
    Li, Kuanguo
    Zhang, Yabo
    Du, Jing
    Ghafoor, Sonia
    Lu, Yonghua
    [J]. APPLIED SURFACE SCIENCE, 2020, 527 (527)
  • [8] Low-damage gate etching with high degree of anisotropy in high-density DRAM cell
    Kim, IG
    Kim, NS
    Park, JS
    Park, DY
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 2002, 41 (4B): : 2380 - 2384
  • [9] A 70NS HIGH-DENSITY CMOS DRAM
    CHWANG, R
    CHOI, M
    CREEK, D
    STERN, S
    PELLEY, P
    SCHUTZ, J
    BOHR, M
    WARKENTIN, P
    YU, K
    [J]. ISSCC DIGEST OF TECHNICAL PAPERS, 1983, 26 : 56 - &
  • [10] An efficient built-in self-test algorithm for neighborhood pattern sensitive faults in high-density memories
    Kang, DC
    Cho, SB
    [J]. KORUS 2000: 4TH KOREA-RUSSIA INTERNATIONAL SYMPOSIUM ON SCIENCE AND TECHNOLOGY, PT 2, PROCEEDINGS: ELECTRONICS AND INFORMATION TECHNOLOGY, 2000, : 218 - 223