ULTRASONIC NON-DESTRUCTIVE BOND EVALUATION - AN ANALYSIS OF THE PROBLEM

被引：0
|
作者：
CHASKELIS, HH
CLARK, AV
机构：
来源：
MATERIALS EVALUATION | 1980年 / 38卷 / 04期
关键词：
Compendex;
D O I：
暂无
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
ADHESIVES
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页码：20 / &
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