Methods for experimental determination of solid-solid interfacial thermal resistance with application to composite materials

被引:0
|
作者
Pietrak, Karol [1 ]
Wisniewski, Tomasz S. [1 ]
机构
[1] Warsaw Univ Technol, Inst Heat Engn, 21-25 Nowowiejska St, PL-00665 Warsaw, Poland
来源
JOURNAL OF POWER TECHNOLOGIES | 2014年 / 94卷 / 04期
关键词
Interfacial thermal resistance; Thermal boundary resistance; Composite materials; Experimental research;
D O I
暂无
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
Interfacial thermal resistance (ITR) exists between filler and matrix in any composite material and has a significant influence on its effective thermal conductivity. To predict the effective thermal conductivity of composite material, the conductivities of each component as well as the ITR must be known. Theoretical models, like the acoustic mismatch model (AMM), allow for accurate ITR determination only for an idealized case of perfect contact (no interfacial gaps and good bonding). The interfacial bonding in typical composites for thermal conduction, like diamond-reinforced metal matrix composites (MMCs) is usually highly imperfect and the ITR, in composites of the same type, depends highly on the individual manufacturing conditions. Therefore, a great need exists for reliable experimental ITR measurement techniques. In this paper, the main difficulties regarding experimental ITR measurements are discussed. A review of measurement techniques is presented, with the main focus put on the principle of each technique and its appropriateness for the purpose of composite materials. The strengths and weaknesses of each technique are discussed.
引用
收藏
页码:270 / 285
页数:16
相关论文
共 50 条
  • [1] Heat conduction across a solid-solid interface: Understanding nanoscale interfacial effects on thermal resistance
    Balasubramanian, Ganesh
    Puri, Ishwar K.
    [J]. APPLIED PHYSICS LETTERS, 2011, 99 (01)
  • [2] INTERFACIAL STABILITY IN SOLID-SOLID TRANSFORMATIONS
    SHEWMON, PG
    [J]. TRANSACTIONS OF THE METALLURGICAL SOCIETY OF AIME, 1965, 233 (04): : 736 - &
  • [3] Experimental determination of solid-solid and solid-liquid interfacial energies of solid ε (CuZn5) in the Zn-Cu alloy
    Kaygisiz, Y.
    Akbulut, S.
    Ocak, Y.
    Keslioglu, K.
    Marasli, N.
    Cadirli, E.
    Kaya, H.
    [J]. JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 487 (1-2) : 103 - 108
  • [4] Reduction of solid-solid thermal boundary resistance by inserting an interlayer
    Liang, Zhi
    Tsai, Hai-Lung
    [J]. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2012, 55 (11-12) : 2999 - 3007
  • [5] Molecular dynamic study of local interfacial thermal resistance of solid-liquid and solid-solid interfaces: Water and nanotextured surface
    Ueki, Yoshitaka
    Matsuo, Satoshi
    Shibahara, Masahiko
    [J]. INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, 2022, 137
  • [6] Polyurethanes as solid-solid phase change materials for thermal energy storage
    Alkan, Cemil
    Guenther, Eva
    Hiebler, Stefan
    Ensari, Omer F.
    Kahraman, Derya
    [J]. SOLAR ENERGY, 2012, 86 (06) : 1761 - 1769
  • [7] Thermal Conductivity Enhancement of Solid-Solid Phase-Change Materials for Thermal Storage
    Son, C. H.
    Morehouse, J. H.
    [J]. JOURNAL OF THERMOPHYSICS AND HEAT TRANSFER, 1991, 5 (01) : 122 - 124
  • [8] Molecular Regulation of Flexible Composite Solid-Solid Phase Change Materials with Controllable Isotropic Thermal Conductivity for Thermal Energy Storage
    Tian, Chong
    Yang, Yunyun
    Liu, Qiang
    Bai, Yuting
    Zhao, Fuqi
    Huang, Lei
    Yang, Na
    Cai, Xufu
    Kong, Weibo
    [J]. ACS APPLIED MATERIALS & INTERFACES, 2023, 15 (10) : 13165 - 13175
  • [9] Review and Evaluation of Effective Thermal Conductivity Model for Solid-solid Binary Composite
    Qian L.
    Yu H.
    Sun Y.
    Deng J.
    Wu D.
    Li Z.
    Huang T.
    [J]. Yuanzineng Kexue Jishu/Atomic Energy Science and Technology, 2020, 54 (03): : 409 - 420
  • [10] CALORIMETRIC STUDY OF EUTECTIC SOLID-SOLID INTERFACIAL ENERGIES
    KIRCHNER, HO
    CHADWICK, GA
    [J]. JOURNAL OF CRYSTAL GROWTH, 1971, 8 (03) : 252 - &