CONTACT ADHESION BETWEEN SOLIDS IN VACUUM .2. DEFORMATION AND INTERFACIAL ENERGY

被引：51
|
作者：
POLLOCK, HM
机构：
来源：
JOURNAL OF PHYSICS D-APPLIED PHYSICS | 1978年 / 11卷 / 01期
关键词：
D O I：
10.1088/0022-3727/11/1/007
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
引用
收藏
页码：39 / 54
页数：16
相关论文
共 50 条
  • [21] INTERFACIAL FREE-ENERGY BETWEEN HARD-SPHERE SOLIDS AND FLUIDS
    MARR, DW
    GAST, AP
    LANGMUIR, 1994, 10 (05) : 1348 - 1350
  • [22] On the correlation of some theoretical and experimental parameters in polycondensation crosslinked networks .2. Interfacial energy and adhesion on cellulose substrates
    Pizzi, A
    JOURNAL OF APPLIED POLYMER SCIENCE, 1997, 65 (09) : 1843 - 1847
  • [23] GENERALIZED APPROACH TO ADHESION VIA INTERFACIAL DEPOSITION OF AMPHIPATHIC MOLECULES .2. ADHESION OF POLYETHYLENE TO ALUMINUM
    SCHONHORN, H
    JOURNAL OF POLYMER SCIENCE PART A-GENERAL PAPERS, 1963, 1 (12): : 3523 - &
  • [24] ADHESION TO SKIN .2. MEASUREMENT OF INTERFACIAL ENERGIES FOR PRESSURE SENSITIVE ADHESIVES
    ANDREWS, EH
    KHAN, TA
    LOCKINGTON, NA
    JOURNAL OF MATERIALS SCIENCE, 1987, 22 (08) : 2833 - 2841
  • [25] EFFECT OF INTERFACIAL BONDING ON THE STRENGTH OF ADHESION OF ELASTOMERS .2. DISSIMILAR ADHERENDS
    CHANG, RJ
    GENT, AN
    JOURNAL OF POLYMER SCIENCE PART B-POLYMER PHYSICS, 1981, 19 (10) : 1635 - 1640
  • [26] Interfacial energy and adhesion between acrylic pressure sensitive adhesives and release coatings
    Li, LH
    Macosko, C
    Korba, GL
    Pocius, AV
    Tirrell, M
    JOURNAL OF ADHESION, 2001, 77 (02): : 95 - 123
  • [27] A study on the interfacial adhesion energy between capping layer and dielectric for cu interconnects
    Kim, Cheol
    Son, Kirak
    Kim, Gahui
    Kim, Sungtae
    Lee, Sol-Kyu
    Lee, So-Yeon
    Park, Young-Bae
    Joo, Young-Chang
    MICROELECTRONICS RELIABILITY, 2021, 116
  • [28] Localized deformation modes and non-Schmid effects in crystalline solids .2. Deformation patterns
    Dao, M
    Asaro, RJ
    MECHANICS OF MATERIALS, 1996, 23 (02) : 103 - 132
  • [29] A study on the interfacial adhesion energy between capping layer and dielectric for cu interconnects
    Kim, Cheol
    Son, Kirak
    Kim, Gahui
    Kim, Sungtae
    Lee, Sol-Kyu
    Lee, So-Yeon
    Park, Young-Bae
    Joo, Young-Chang
    Park, Young-Bae (ybpark@anu.ac.kr), 1600, Elsevier Ltd (116):
  • [30] Model for contact between finger and sinusoidal plane to evaluate adhesion and deformation component of friction
    Duvefelt, Kenneth
    Olofsson, Ulf
    Johannesson, Carl Michael
    Skedung, Lisa
    TRIBOLOGY INTERNATIONAL, 2016, 96 : 389 - 394
12345