THERMAL CYCLING UNDER LOADING OF SINGLE CRYSTAL Cu-Al-Ni AFTER AGING

被引：0

作者：

Corro, Ignacio ^{[1
]}

Araujo, Abigail ^{[1
]}

Beiroa, Juan I. ^{[1
]}

Gastien, Rosana ^{[1
]}

机构：

[1] UNIDEF, Inst Invest Cient & Tecn Def CITEDEF, Dept Invest Solidos, CONICET,MINDEF, Buenos Aires, DF, Argentina

来源：

AVANCES EN CIENCIAS E INGENIERIA | 2016年 / 7卷 / 02期

关键词：

shape memory alloys; Cu-based alloys; thermal cycling under stress; aging;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this paper, a study of single crystal Cu-14.3Al-4.1Ni (%wt) subjected to thermal cycling under loading is presented. Shape memory Cu-Al-Ni has low diffusion at temperatures above room temperature. Therefore, it is interesting to know your answer in working conditions and after being aged in this temperature range. Specimens were characterized before and after aging, using a device designed by the authors. Parameters such as critical temperatures and hysteresis width, the repeatability of the curves and the type of TM induced were analyzed. These parameters have changes then the aging or contribute to that may influence the design of applications.

引用

页码：37 / 44

页数：8

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