MODELING AND ANALYSIS OF MULTICHIP-MODULE POWER-SUPPLY PLANES

被引：137
|
作者：
LEE, K
BARBER, A
机构：
[1] Hewlett-Packard Laboratories, Palo Alto
来源：
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 1995年 / 18卷 / 04期
关键词：
D O I：
10.1109/96.475268
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A method that would allow accurate modeling of arbitrarily shaped planes with bypass capacitors has been developed, It is compatible with a SPICE-based modeling method for the rest of the power supply hierarchy and the devices. A modified SPICE is used to accommodate distributed circuits. The distributed circuits are built with microwave analysis software and connected to SPICE by s-parameter files. The modeling process is described and examples of thick and thin-film power supply planes are presented with comparison to measured results. The method is used to explore potential design choices for a large MCM with many simultaneously switching drivers.
引用
收藏
页码：628 / 639
页数：12
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