INTERFACIAL PROCESSING AND ADHESION OF DIAMOND, DIAMOND-LIKE, AND TIN FILMS ON METALLIC AND POLYMERIC SUBSTRATES

Diamond, diamond-like, and titanium nitride (TiN) films have extremely desirable chemical, electrical, and mechanical properties for a variety of applications ranging from corrosion- and erosion-resistant coatings to electronics packaging of microelectronic devices. However, many of these applications are limited by the poor adhesion of these films to metal and polymer substrates. The adhesion of a film is determined primarily by internal stresses in the film, thermal and lattice mismatch, and most importantly by interfacial bonding. We have developed methods based on mechanical interlocking, chemical bonding, grading of interatomic potentials, and the multilayer discontinuous thin films approach to control stresses and strains in thin films. A substantial improvement in adhesion and wear properties is obtained by using these methods selectively. We review issues related to the adhesion of diamond, diamond-like carbon, and TiN films on metal and polymeric substrates.