RELIABILITY ASSURANCE OF APPLICATION-SPECIFIC MICROELECTRONIC CIRCUITS

被引：0
|
作者：
SHEU, BJ
HSU, WJ
TYREE, V
机构：
来源：
PROCEEDINGS ANNUAL RELIABILITY AND MAINTAINABILITY SYMPOSIUM | 1990年 / SYM期
关键词：
COMPUTER-AIDED RELIABILITY PREDICTION; RELIABILITY MODELING; CIRCUIT RELIABILITY SIMULATION; DESIGN FOR RELIABILITY; HOT CARRIER EFFECT; ELECTROMIGRATION; VLSI;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
To provide intelligent design automation systems for microelectronics designers to explore the full capabilities of the state-of-the-art fabrication technologies, an integrated-circuit reliability simulator has been developed. Model parameters for the reliability simulation are obtained through accelerated tests on specially-designed test structures. Design of several test chips and associated experimental results are presented. The integrated-circuit reliability simulation is to be extensively used in the modern microelectronics industry to provide useful product reliability data.
引用
收藏
页码：381 / 388
页数：8
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