NEW PRODUCTION TECHNOLOGIES FOR PCBS IN THE 90S

被引：0

作者：

MESSNER, G

机构：

[1] Kollmorgen Corp, Melville, NY, USA, Kollmorgen Corp, Melville, NY, USA

来源：

ALTA FREQUENZA | 1988年 / 57卷 / 01期

关键词：

ELECTRONIC CIRCUITS - ELECTRONICS PACKAGING - INTEGRATED CIRCUIT MANUFACTURE - THERMOPLASTICS - Applications;

D O I：

暂无

中图分类号：

TN [电子技术、通信技术];

学科分类号：

0809 ;

摘要：

Due to stringent market demands, the methods of interconnecting electronic components will be in the next decade considerably different from the ones today. The paper takes a look at the following issues of the problem: forecast printed board technological refinements, changes in operational methods in manufacturing, and alternate technologies to meet new packaging requirements.

引用

页码：3 / 14

页数：12

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