QUANTITATIVE DEFINITION OF THIN METAL FILMS ADHESION WITH GLASS

被引：0

作者：

Belous, V. A. ^{[1
]}

Lunev, V. M. ^{[1
]}

Pavlov, V. S. ^{[1
]}

Turchina, A. K. ^{[1
]}

机构：

[1] Kharkov Inst Phys & Technol, Naval & Sci Ctr, Kharkov, Ukraine

来源：

PROBLEMS OF ATOMIC SCIENCE AND TECHNOLOGY | 2006年 / 04期

关键词：

D O I：

暂无

中图分类号：

O57 [原子核物理学、高能物理学];

学科分类号：

070202 ;

摘要：

The technique of quantitative definition of strenght of adhesion thin copper films with a surface of glass substrates by a method of scrath is described. The copper coverings were deposited by a vacuum-arc method. It was shown, that in an interval of films thickness from similar to 0,04 up to similar to 0,2 mu m the strength of adhesion was similar to 40 MPa. With the further increase of thickness of the films up to similar to 1 mu m the strength of adhesion reduced down to similar to 2 MPa.

引用

页码：221 / 223

页数：3

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