PACKAGING BY PASSIVE COOLING REDUCES MANUFACTURING COSTS OF LASER-DIODE ARRAYS

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作者：
KARPINSKI, AA
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来源：
LASER FOCUS WORLD | 1994年 / 30卷 / 10期
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O43 [光学];
学科分类号：
070207 ; 0803 ;
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页码：155 / &
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