Temperature and strain rate dependent tensile behavior of polycrystalline nanocopper under dynamic loading

In this work, thermomechanical response of polycrystalline nanocopper has been studied using molecular dynamic simulation in equilibrium conditions. The behavioral change of polycrystalline nanocopper has been studied at different strain rates i.e., 5 x 10(8) s(-1), 1 x 10(9) s(-1), 5 x 10(9) s(-1), 1 x 10(10) s(-1) and 5 x 10(10) s(-1). The response of copper with increasing discrete temperatures from 100 K to 500 K, at steps of 100 K each, has also been analyzed. Embedded Atom Method (EAM) potential is used which governs the interaction amongst atoms and helps in finding out the positions of atoms using Newton's second law of motion. Results have shown the dependency of Young's modulus, yield strength, ultimate strength on strain rate and temperature. It has been observed that when the strain rate is increased, Young's modulus also increases along with the increase in yield strength and ultimate strength. The Young's modulus, yield strength, and ultimate strength show inverse relation with the increase in temperature. The results provide a base for further investigation of polycrystalline nanomaterials with effects of other parameters. The study may also be helpful for the researchers to predict the mechanical behavior of a polycrystalline nanomaterial under varying strain rate and temperature during its synthesis via bottom-up approach or surface modification. Copyright (C) 2022 Elsevier Ltd. All rights reserved. Selection and peer-review under responsibility of the scientific committee of the International Conference on Advances in Materials and Mechanical Engineering. (ICAMME-2022).