DAMAGE TO THE SILICON LATTICE BY REACTIVE ION ETCHING

被引:20
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作者
STRUNK, HP
CERVA, H
MOHR, EG
机构
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D O I
10.1149/1.2095452
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
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页码:2876 / 2880
页数:5
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