REAL-TIME MONITORING OF SEMICONDUCTOR PROCESS UNIFORMITY

被引：0
|
作者：
PERLOFF, DS
HASAN, TF
BLOME, ER
机构：
来源：
SOLID STATE TECHNOLOGY | 1980年 / 23卷 / 02期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The use of automated test and computing equipment for the real-time monitoring of semiconductor process uniformity is discussed. A description is given of the measurement techniques, test vehicles and equipment required to produce two-dimensional plots of sheet resistance, line-width, mask alignment error, and film thickness. Examples are given of the application of these techniques to the evaluation and control of semiconductor equipment and processes.
引用
收藏
页码：81 / 86
页数：6
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