FLOW OF OXIDE LAYER DURING OXIDATION OF COPPER

被引:11
|
作者
MOORE, WJ
机构
来源
JOURNAL OF CHEMICAL PHYSICS | 1953年 / 21卷 / 06期
关键词
D O I
10.1063/1.1699130
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
引用
收藏
页码:1117 / 1117
页数:1
相关论文
共 50 条
  • [11] OXIDATION-STATES OF COPPER DURING REDUCTION OF CUPRIC OXIDE IN METHANOL CATALYSTS
    HIMELFARB, PB
    WAWNER, FE
    BIESER, A
    VINES, SN
    JOURNAL OF CATALYSIS, 1983, 83 (02) : 469 - 471
  • [12] Surface and Interface Processes during Atomic Layer Deposition of Copper on Silicon Oxide
    Dai, Min
    Kwon, Jinhee
    Halls, Mathew D.
    Gordon, Roy G.
    Chabal, Yves J.
    LANGMUIR, 2010, 26 (06) : 3911 - 3917
  • [13] Dependence of degree of orientation of copper oxide nuclei on oxygen pressure during initial stages of copper oxidation
    Luo, Langli
    Kang, Yihong
    Liu, Zhenyu
    Yang, Judith C.
    Zhou, Guangwen
    PHYSICAL REVIEW B, 2011, 83 (15)
  • [14] Oxide evolution on the SiC layer of TRISO particles during extended air oxidation
    Bratten, Adam
    Jalan, Visharad
    Gerczak, Tyler
    Wen, Haiming
    JOURNAL OF NUCLEAR MATERIALS, 2022, 558
  • [15] Si and C emission into the oxide layer during the oxidation of silicon carbide and its influence on the oxidation rate
    Hijikata, Yasuto
    Asafuji, Ryosuke
    Konno, Ryotaro
    Akasaka, Yurie
    Shinoda, Ryo
    AIP ADVANCES, 2015, 5 (06):
  • [16] Direct atomic-scale observation of layer-by-layer oxide growth during magnesium oxidation
    Zheng, He
    Wu, Shujing
    Sheng, Huaping
    Liu, Chun
    Liu, Yu
    Cao, Fan
    Zhou, Zhichao
    Zhao, Xingzhong
    Zhao, Dongshan
    Wang, Jianbo
    APPLIED PHYSICS LETTERS, 2014, 104 (14)
  • [17] Oxide layer on a polished copper surface
    Dobinski, S
    NATURE, 1936, 138 : 31 - 31
  • [18] Copper Sediment Toxicity and Partitioning during Oxidation in a Flow-Through Flume
    Costello, David M.
    Hammerschmidt, Chad R.
    Burton, G. Allen
    ENVIRONMENTAL SCIENCE & TECHNOLOGY, 2015, 49 (11) : 6926 - 6933
  • [19] Effect of Flow Field Changes on Copper Deposition Layer during Jet Electrodeposition
    Li, Zihao
    Peng, Wenhai
    Wang, Yanhu
    Fang, Tiehui
    Surface Technology, 2024, 53 (14): : 207 - 215
  • [20] Surface coordination layer passivates oxidation of copper
    Peng, Jian
    Chen, Bili
    Wang, Zhichang
    Guo, Jing
    Wu, Binghui
    Hao, Shuqiang
    Zhang, Qinghua
    Gu, Lin
    Zhou, Qin
    Liu, Zhi
    Hong, Shuqin
    You, Sifan
    Fu, Ang
    Shi, Zaifa
    Xie, Hao
    Cao, Duanyun
    Lin, Chang-Jian
    Fu, Gang
    Zheng, Lan-Sun
    Jiang, Ying
    Zheng, Nanfeng
    NATURE, 2020, 586 (7829) : 390 - +