THE 8-INCH WAFER CASTS ITS SHADOW OVER SEMICON WEST

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LYMAN, J
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ELECTRONICS | 1988年 / 61卷 / 11期
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页码:45 / 47
页数:3
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  • [1] TSMC EXPEDITES SECOND 8-INCH WAFER FAB
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    [J]. ELECTRONICS-US, 1995, 68 (05): : 7 - 7
  • [2] Yield enhancement in a high-volume 8-inch wafer fab
    Motorola, Chandler, United States
    [J]. Semicond Int, 8 ([d]4pp):
  • [3] DEMONSTRATING ELECTRICAL CONNECTION ON RECONSTITUTED ASIC CHIPS ON 8-INCH SILICON WAFER
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  • [4] Production of 8-inch SiC wafer by hybridization of single and polycrystalline SiC wafers
    Murata, K
    Fujioka, N
    Chinone, Y
    Nishino, S
    [J]. SILICON CARBIDE AND RELATED MATERIALS - 2002, 2002, 433-4 : 241 - 244
  • [5] Towards vertical power device 3D packaging on 8-inch wafer
    Letowski, Bastien
    Widiez, Julie
    Rabarot, Marc
    Vandendacle, William
    Imbert, Bruno
    Rouger, Nicolas
    Crebier, Jean-Christophe
    [J]. 2016 28TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD), 2016, : 135 - 138
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    Chae, Ki-Woong
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