共 50 条
- [1] SILICON HIGH-DENSITY CAPACITORS FOR POWER DECOUPLING APPLICATIONS [J]. 2015 IEEE INTERNATIONAL WORKSHOP ON INTEGRATED POWER PACKAGING (IWIPP), 2015, : 48 - 51
- [2] Electrical Characterization of Novel Material for High-density Capacitors [J]. 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 1655 - 1658
- [3] Embedded High-Density Trench Capacitors for Smart Catheters [J]. 2020 IEEE 8TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2020,
- [4] HERES WHAT TO CONSIDER IN SELECTING HIGH-DENSITY STORAGE [J]. MUSEUM NEWS, 1989, 68 (02): : 80 - 81
- [5] MASS SOLDERING OF HIGH-DENSITY CIRCUIT PACKS [J]. WESTERN ELECTRIC ENGINEER, 1979, 23 (04): : 38 - 42
- [6] GOLD CONDUCTOR PASTES FOR HIGH-DENSITY CIRCUIT [J]. ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1981, 9 (01): : 31 - 41
- [8] High energy density capacitors for EML applications [J]. 2004 12TH SYMPOSIUM ON ELECTROMAGNETIC LAUNCH TECHNOLOGY, 2004, : 229 - 232
- [9] Challenges in introducing high-density interconnect technology in printed circuit boards for space applications [J]. CEAS Space Journal, 2023, 15 : 101 - 112