GANG BONDING TO STANDARD ALUMINIZED INTEGRATED-CIRCUITS WITH BUMPED INTERCONNECT TAPE

被引：0

作者：

BURNS, CD ^{[1
]}

KANZ, JW ^{[1
]}

机构：

[1] GEN DYNAM,POMONA DIV,POMONA,CA

来源：

SOLID STATE TECHNOLOGY | 1978年 / 21卷 / 09期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：79 / 81

页数：3

共 31 条

[1] GANG LEAD BONDING INTEGRATED-CIRCUITS
ANGELUCCI, T
SOLID STATE TECHNOLOGY, 1976, 19 (07) : 21 - 25
[2] PRELOADING COMPLIANT BONDING TAPE WITH BEAM-LEAD INTEGRATED-CIRCUITS
GRUSZKA, RF
WESTERN ELECTRIC ENGINEER, 1976, 20 (04): : 16 - 21
[3] PRELOADING COMPLIANT BONDING TAPE WITH BEAM-LEAD INTEGRATED-CIRCUITS
GRUSZKA, RF
SOLID STATE TECHNOLOGY, 1977, 20 (09) : 61 - 65
[4] INTEGRATED-CIRCUITS WITH LEADS ON FLEXIBLE TAPE
VANDERDRIFT, A
GELLING, WG
RADEMAKERS, A
SOLID STATE TECHNOLOGY, 1976, 19 (02) : 27 - 35
[5] INTEGRATED-CIRCUITS WITH LEADS ON FLEXIBLE TAPE
VANDERDRIFT, A
GELLING, WG
RADEMAKERS, A
PHILIPS TECHNICAL REVIEW, 1974, 34 (04): : 85 - 95
[6] OPTICAL INTERCONNECT OF DIGITAL INTEGRATED-CIRCUITS AND SYSTEMS
HUSAIN, A
PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS, 1984, 466 : 10 - 20
[7] MODELING OF COUPLED INTERCONNECT LINES FOR INTEGRATED-CIRCUITS
YUAN, JS
EISENSTADT, WR
LIOU, JJ
INTERNATIONAL JOURNAL OF ELECTRONICS, 1991, 70 (04) : 751 - 764
[8] GOLD PLATING OF COPPER TAPE FOR INTEGRATED-CIRCUITS IN TAB ASSEMBLY
GURSKY, MT
SZKUDLAPSKI, AH
PLATING AND SURFACE FINISHING, 1982, 69 (11): : 45 - 45
[9] SPEED LIMITATIONS DUE TO INTERCONNECT TIME CONSTANTS IN VLSI INTEGRATED-CIRCUITS
SINHA, AK
COOPER, JA
LEVINSTEIN, HJ
ELECTRON DEVICE LETTERS, 1982, 3 (04): : 90 - 92
[10] PROPAGATION DELAYS OF INTERCONNECT LINES IN LARGE-SCALE INTEGRATED-CIRCUITS
WILHELM, W
SIEMENS FORSCHUNGS-UND ENTWICKLUNGSBERICHTE-SIEMENS RESEARCH AND DEVELOPMENT REPORTS, 1986, 15 (02): : 60 - 63

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