THICKNESS MEASUREMENTS OF THIN-FILMS DEPOSITED ON SUBSTRATES

被引:0
|
作者
FOULU, J [1 ]
HENOC, J [1 ]
机构
[1] CTR NATL ETUD TELECOMMUN,PEC,F-92220 BAGNEUX,FRANCE
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:619 / 625
页数:7
相关论文
共 50 条
  • [31] RAPID THERMAL ANNEALING OF YBACUO THIN-FILMS DEPOSITED ON SIO2 SUBSTRATES
    MA, QY
    YANG, ES
    CHANG, CA
    [J]. JOURNAL OF APPLIED PHYSICS, 1989, 66 (04) : 1866 - 1868
  • [32] ABSORPTION-COEFFICIENT MEASUREMENTS FOR VACUUM-DEPOSITED CUTERNARY THIN-FILMS
    SUN, LY
    KAZMERSKI, LL
    CLARK, AH
    IRELAND, PJ
    MORTON, DW
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1978, 15 (02): : 265 - 268
  • [33] HARDNESS MEASUREMENTS OF THIN-FILMS
    JONSSON, B
    HOGMARK, S
    [J]. THIN SOLID FILMS, 1984, 114 (03) : 257 - 269
  • [34] NONLINEARITY MEASUREMENTS OF THIN-FILMS
    HELLSTROM, S
    WESEMEYER, H
    [J]. VACUUM, 1977, 27 (04) : 339 - 343
  • [35] OPTICAL-PROPERTIES AND DURABILITY OF THIN-FILMS DEPOSITED ON VIBRATING SUBSTRATES AT ULTRASONIC FREQUENCIES
    UCHIL, J
    SHANBHOGUE, HG
    THUTUPALLI, GKM
    [J]. THIN SOLID FILMS, 1989, 170 (01) : 27 - 34
  • [36] THIN-FILMS OF 123 ON SILICON SUBSTRATES
    PUZZER, T
    ZHENG, ZT
    BOSI, S
    RUSSELL, GJ
    TAYLOR, KNR
    [J]. PHYSICA C, 1989, 162 : 603 - 604
  • [37] TESTING OF ADHESION OF THIN-FILMS TO SUBSTRATES
    PAWEL, JE
    MCHARGUE, CJ
    [J]. JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 1988, 2 (05) : 369 - 383
  • [38] CHARACTERIZATION OF YBACUO AND ERBACUO THIN-FILMS DEPOSITED ON SILICON AND GALLIUM-ARSENIDE SUBSTRATES
    CHIN, DK
    VANDUZER, T
    HANSEN, WL
    YU, KM
    STICKLE, WF
    LEE, SY
    MURDOCK, B
    [J]. IEEE TRANSACTIONS ON MAGNETICS, 1989, 25 (02) : 961 - 964
  • [39] RESISTIVE THIN-FILMS ON GLASS SUBSTRATES
    DROGUET, JP
    [J]. ANNALES DE CHIMIE FRANCE, 1975, 10 (4-5): : 275 - 279
  • [40] THICKNESS UNIFORMITY OF THIN-FILMS DEPOSITED ON A FLAT SUBSTRATE BY SPUTTERING OF A TARGET WITH ROTATIONAL SYMMETRY
    SHISHKOV, M
    POPOV, D
    [J]. VACUUM, 1991, 42 (15) : 1005 - 1008