EFFECTS OF THE MICROELECTRONICS REVOLUTION ON SYSTEMS AND BOARD TEST

被引:0
|
作者
FOLEY, E
机构
关键词
D O I
暂无
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
引用
收藏
页码:32 / 38
页数:7
相关论文
共 50 条
  • [31] Implantable biomimetic microelectronics systems
    Liu, Wentai
    Humayun, Mark S.
    Liker, Mark A.
    PROCEEDINGS OF THE IEEE, 2008, 96 (07) : 1073 - 1074
  • [32] MICROELECTRONICS AND INTEGRATION OF COMMUNICATIONS SYSTEMS
    IVANOVA, ON
    YERSHOV, VA
    ERSHOVA, EB
    ROGINSKIY, VN
    TELECOMMUNICATIONS AND RADIO ENGINEERING, 1974, 28-9 (08) : 9 - 16
  • [33] Thermal design of microelectronics systems
    Fedasyuk, D
    Makar, V
    Smart Sensors and MEMS, 2004, 181 : 289 - 329
  • [34] Direct immersion cooled microelectronics heat sinks: Effects of test fluid and bonding technique
    Bhavnani, SH
    Jaeger, RC
    JOURNAL OF ELECTRONICS MANUFACTURING, 2000, 10 (04): : 271 - 281
  • [36] THE NEW ALCHEMISTS - SILICON VALLEY AND THE MICROELECTRONICS REVOLUTION - HANSON,D
    FROEHLICH, L
    DATAMATION, 1982, 28 (12): : 205 - &
  • [37] Tiny test tubes pave way in microelectronics
    不详
    MACHINE DESIGN, 1997, 69 (04) : 29 - 29
  • [38] Test and health monitoring of microelectronics using RFID
    Keinhorst, T.
    Tsigkourakos, P.
    Yaqoob, M. A.
    van Driel, W. D.
    Zhang, G. Q.
    ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, : 759 - 764
  • [39] New Methodologies for Evaluating Microelectronics Subject to Board-level Vibrations
    Khaldarov, Valeriy
    Xie, Dongji
    Lee, Jeffrey
    Shalumov, Alexander
    IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), 2021, : 1366 - 1375
  • [40] Boundary scan as a test solution in microelectronics curricula
    Rucinski, A
    Dziurla-Rucinska, B
    FIRST IEEE INTERNATION WORKSHOP ON ELECTRONIC DESIGN, TEST AND APPLICATIONS, PROCEEDINGS, 2002, : 214 - 218