TRENDS IN SEMICONDUCTOR PACKAGING

被引:0
|
作者
GROSS, DR
机构
来源
ELECTRONICS AND POWER | 1982年 / 28卷 / 10期
关键词
D O I
10.1049/ep.1982.0345
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
SEMICONDUCTOR DEVICES
引用
收藏
页码:694 / 697
页数:4
相关论文
共 50 条
  • [41] Trends in advanced packaging design
    Rinebold, Kevin
    Landers, Leslie
    Schaertl, Lisa
    [J]. Advanced Packaging, 1999, 8 (01):
  • [42] Packaging Materials Trends and Outlook
    Tracy, D. P.
    [J]. CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2012 (CSTIC 2012), 2012, 44 (01): : 871 - 875
  • [43] REQUIREMENTS AND TRENDS IN THE PACKAGING INDUSTRY
    STEIGERWALD, F
    [J]. KUNSTSTOFFE-GERMAN PLASTICS, 1987, 77 (05): : 526 - 528
  • [44] Global demands and trends in packaging
    Somerville, RW
    [J]. TAPPI POLYMERS, LAMINATIONS & COATINGS CONFERENCE, VOLS 1 AND 2, 1999, : 3 - 3
  • [45] TRENDS IN ADVANCED PACKAGING TECHNOLOGY
    BALDE, JW
    [J]. COMPUTER, 1992, 25 (12) : 67 - 68
  • [46] Emerging trends in food packaging
    Sharma, Rajan
    Ghoshal, Gargi
    [J]. NUTRITION & FOOD SCIENCE, 2018, 48 (05): : 764 - 779
  • [47] Market trends in packaging automation
    Adept Technology Inc, San Jose, United States
    [J]. Rob World, 4 (44-47):
  • [48] FUTURE-TRENDS IN PACKAGING
    BEAN, PG
    [J]. JOURNAL OF APPLIED BACTERIOLOGY, 1986, 61 (06): : R4 - R4
  • [49] Trends & challenges in microsystems packaging
    Iyer, MK
    [J]. THERMAL AND MECHANICAL SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS, 2004, : 9 - 9
  • [50] Packaging Trends Shift Green
    McIntyre, Karen
    [J]. Nonwovens Industry, 2024, 55 (11): : 50 - 55