TRENDS IN SEMICONDUCTOR PACKAGING

被引:0
|
作者
GROSS, DR
机构
来源
ELECTRONICS AND POWER | 1982年 / 28卷 / 10期
关键词
D O I
10.1049/ep.1982.0345
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
SEMICONDUCTOR DEVICES
引用
收藏
页码:694 / 697
页数:4
相关论文
共 50 条
  • [1] TRENDS IN SEMICONDUCTOR PACKAGING
    RICHARDS, R
    [J]. ELECTRONIC PRODUCTS MAGAZINE, 1989, 32 (06): : 59 - 62
  • [2] FUTURE SEMICONDUCTOR PACKAGING TRENDS
    MARSTON, P
    [J]. ELECTRONIC ENGINEERING, 1982, 54 (669): : 145 - &
  • [3] Trends in power semiconductor packaging
    Desbiens, D
    [J]. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005, : 6 - 6
  • [4] Trends in automotive power semiconductor packaging
    Dietrich, Peter
    [J]. MICROELECTRONICS RELIABILITY, 2013, 53 (9-11) : 1681 - 1686
  • [5] From packaging to "Un"-packaging - Trends in Power Semiconductor Modules
    Stockmeier, Thomas
    [J]. ISPSD 08: PROCEEDINGS OF THE 20TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES & ICS, 2008, : 12 - 19
  • [6] Trends of power semiconductor wafer level packaging
    Liu, Yong
    [J]. MICROELECTRONICS RELIABILITY, 2010, 50 (04) : 514 - 521
  • [7] Packaging trends for semiconductor lasers for DWDM-applications
    Vreeburg, CGM
    Groeneveld, CM
    [J]. 49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, : 1 - 4
  • [8] Packaging trends for semiconductor lasers for DWDM-applications
    Vreeburg, C.G.M.
    Groeneveld, C.M.
    [J]. Proceedings - Electronic Components and Technology Conference, 1999, : 1 - 4
  • [9] Trends in packaging of high power semiconductor laser bars
    Solarz, RW
    Emanuel, MA
    Skidmore, JA
    Freitas, BL
    Krupke, WF
    [J]. LASER PHYSICS, 1998, 8 (03) : 737 - 740
  • [10] Packaging trends
    Warth, AH
    [J]. INDUSTRIAL AND ENGINEERING CHEMISTRY, 1943, 35 : 43 - 46