INTERFACIAL BOND STRENGTH IN ALUMINA CERAMICS METALLIZED AND COFIRED WITH TUNGSTEN

被引：0
|
作者：
OTSUKA, K
USAMI, T
SEKIHATA, M
机构：
来源：
AMERICAN CERAMIC SOCIETY BULLETIN | 1981年 / 60卷 / 05期
关键词：
Compendex;
D O I：
暂无
中图分类号：
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
ALUMINA
引用
收藏
页码：540 / 545
页数：6
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