INVESTIGATION OF POLARIZATION DURING ELECTRODEPOSITION OF ALLOY COPPER-TIN FROM TRIPOLYPHOSPHATE ELECTROLYTES

被引：0
|
作者：
KUDRA, OK
NASONOVA, MN
GALINKER, VS
机构：
来源：
UKRAINSKII KHIMICHESKII ZHURNAL | 1972年 / 38卷 / 09期
关键词：
D O I：
暂无
中图分类号：
O6 [化学];
学科分类号：
0703 ;
摘要：
引用
收藏
页码：875 / &
相关论文
共 50 条
  • [31] New insights into the mechanism of selective flotation of copper and copper-tin alloy
    Wang, Xun
    Liu, Wei
    Jiao, Fen
    Qin, Wenqing
    Yang, Congren
    SEPARATION AND PURIFICATION TECHNOLOGY, 2020, 253
  • [32] ELECTRODEPOSITION OF COPPER-ZINC ALLOY FROM CITRATE ELECTROLYTES
    NEVMYATULLINA, KA
    TEMKIN, SM
    VAGRAMYAN, TA
    PROTECTION OF METALS, 1991, 27 (01): : 121 - 123
  • [33] Electrodeposition behaviors and corrosion resistance of copper-tin alloy coating in chcl-eg deep eutectic solvents
    Li Q.-S.
    Qian H.-X.
    Fu X.
    Sun H.-J.
    Sun J.
    Sun, Jie (jiersun2000@126.com), 1600, Chongqing Wujiu Periodicals Press (50): : 313 - 318
  • [34] CHEMICAL STATE ANALYSIS OF TIN IN COPPER-TIN ALLOY USING MOSSBAUER EFFECT
    YOSHIDA, H
    YONEZAWA, C
    JAPAN ANALYST, 1971, 20 (08): : 970 - &
  • [35] COPPER-TIN ALLOY + GTAW = AQUAMOBILE IN TULSAS HELMERICH PARK
    不详
    WELDING JOURNAL, 1978, 57 (01) : 44 - 46
  • [36] SINTERING IN COPPER-TIN SYSTEM .2. ALLOY BEHAVIOR
    ACHARYA, NN
    MUKUNDA, PG
    INTERNATIONAL JOURNAL OF POWDER METALLURGY, 1995, 31 (01): : 73 - 79
  • [37] STRESS-EXTENSION BEHAVIOR OF COPPER-TIN ALLOY WHISKERS
    NOHARA, A
    YONEZAWA, N
    IMURA, T
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1982, 21 (01): : 194 - 195
  • [38] Structural analysis of selective laser melted copper-tin alloy
    Rahmani, Ramin
    Resende, Pedro R.
    Couto, Rúben
    Lopes, Sérgio I.
    Kumar, Rahul
    Maurya, Himanshu S.
    Karimi, Javad
    Afonso, Alexandre M.
    Hussain, Abrar
    Abrantes, João C.C.
    Journal of Alloys and Metallurgical Systems, 2024, 7
  • [39] Formation and growth of copper-tin intermetallics during soldering
    Zaruzi, S
    Seah, CH
    Chandel, RS
    Sritharan, T
    PROCESSING AND FABRICATION OF ADVANCED MATERIALS VI, VOLS 1 & 2, 1998, : 1927 - 1934
  • [40] Electrodeposition of tin-antimony alloy from sulfate electrolytes with organic additives
    Medvedev, GI
    Makrushin, NA
    Fursova, NY
    RUSSIAN JOURNAL OF APPLIED CHEMISTRY, 2001, 74 (09) : 1465 - 1469
12345