BEHAVIOR OF DRAMMEN PLASTIC CLAY UNDER LOW EFFECTIVE STRESSES

被引：0
|
作者：
RAMANATHAIYER, TS [1 ]
机构：
[1] TRIUAN DRUM COLL ENGN,TRIVANDRUM 695016,KERALA,INDIA
来源：
CANADIAN GEOTECHNICAL JOURNAL | 1975年 / 12卷 / 01期
关键词：
D O I：
暂无
中图分类号：
P5 [地质学];
学科分类号：
0709 ; 081803 ;
摘要：
引用
收藏
页码：70 / 83
页数：14
相关论文
共 50 条
  • [41] Resilient and plastic strain behavior of freezing-thawing mucky clay under subway loading in Shanghai
    Tang, Yiqun
    Li, Jun
    Wan, Peng
    Yang, Ping
    NATURAL HAZARDS, 2014, 72 (02) : 771 - 787
  • [42] NUMERICAL MODELING OF STRESSES IN THE MASSIF OF A CLAY SOIL UNDER THE FOUNDATION
    Khristich, D., V
    Astapov, Yu, V
    Artyukh, E., V
    Sokolova, M. Yu
    PROCEEDINGS OF THE TULA STATES UNIVERSITY-SCIENCES OF EARTH, 2019, 4 : 312 - 319
  • [43] Creep behavior at very low stresses
    Mohamed, FA
    CREEP DEFORMATION: FUNDAMENTALS AND APPLICATIONS, 2002, : 71 - 83
  • [44] The mechanical behaviour of weak mudstone (Opalinus Clay) at low stresses
    Corkum, A. G.
    Martin, C. D.
    INTERNATIONAL JOURNAL OF ROCK MECHANICS AND MINING SCIENCES, 2007, 44 (02) : 196 - 209
  • [45] Deflection and Stresses of Effective Micro-cantilever Beam designs under low mass loading
    Parsediya, Deep Kishore
    2016 INTERNATIONAL CONFERENCE ON ELECTRICAL POWER AND ENERGY SYSTEMS (ICEPES), 2016, : 111 - 114
  • [46] EFFECTS OF FREEZE THAW AND SOFTENING ON A NATURAL CLAY AT LOW STRESSES
    GRAHAM, J
    AU, VCS
    CANADIAN GEOTECHNICAL JOURNAL, 1985, 22 (01) : 69 - 78
  • [47] An effective method for calculation of corner stresses with applications to plastic IC packages
    Zhou, Wei
    Lim, Kian-Meng
    Tay, Andrew A.
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2008, 31 (02): : 245 - 251
  • [48] ROLE OF INTERNAL AND EFFECTIVE STRESSES IN PLASTIC FLOW OF IRON SINGLE CRYSTALS
    SPITZIG, WA
    KEH, AS
    METALLURGICAL TRANSACTIONS, 1970, 1 (12): : 3325 - &
  • [49] The applicability of modified Cam-clay model for low plastic clays under anisotropic loading conditions
    Song Lee
    Je Sung Jeon
    Tae Hwoon Kim
    KSCE Journal of Civil Engineering, 2003, 7 (4) : 371 - 379
  • [50] An effective method for calculation of corner stresses with applications to plastic IC packages
    Wei, Z
    Meng, LK
    Tay, A
    6TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS (EPTC 2004), 2004, : 534 - 540
12345