CADMIUM, TIN, AND LEAD ELECTRODEPOSITION IN DIMETHYL FORMAMIDE SOLUTIONS ON ANOTHER METALLIC SUPPORT

被引：1

作者：

LOJOU, E

DEVAUD, M

TROUPEL, M

PERICHON, J

机构：

[1] Laboratoire d'Electrochimie Catalyse et Synthèse Oraganique, CNRS

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1993年 / 140卷 / 08期

关键词：

D O I：

10.1149/1.2220789

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

The electrocrystallization of cadmium, tin, or lead at a gold microelectrode has been studied in DMF solutions. For each deposited metal, the deposit grew through a 3D-nucleation diffusion-controlled process. The electroreduction of residual water on these deposits has been analyzed. The influence of the deposit structure on this phenomenom has been assessed.

引用

页码：2157 / 2162

页数：6

共 22 条

[21] SELECTIVE ELECTROEXTRACTION OF BASE METALS FROM LEACHING SOLUTIONS OBTAINED DURING THE RECYCLING OF WASTE PRINTED CIRCUIT BOARDS. II. SELECTIVE POTENTIOSTATIC ELECTRODEPOSITION OF COPPER, TIN AND LEAD
Frincu, Marian-Iosif
Covaci, Eniko
Dorneanu, Sorin-Aurel
Ilea, Petru
[J]. STUDIA UNIVERSITATIS BABES-BOLYAI CHEMIA, 2021, 66 (02): : 137 - 149
[22] EFFECT OF SMALL AMOUNTS OF TIN, CADMIUM, AND LEAD, ADDED TO THE SOLDER, ON THE CONTACT RESISTANCE OF THERMOCOUPLES BASED ON SINGLE-CRYSTALS OF SOLID-SOLUTIONS OF THE SYSTEMS BI2TE3-BI2SE3 AND BI2TE3-SB2TE3
DZHAMALOV, NA
BARKHALOV, BS
SALAEV, EY
ABDINOV, DS
[J]. INORGANIC MATERIALS, 1983, 19 (02) : 300 - 302

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