共 50 条
- [21] THE RELATION BETWEEN SELF-DIFFUSION AND MELTING PROCESSES RUSSIAN METALLURGY, 1989, (05): : 30 - 33
- [24] Analysis and Experimental Study of the Package Stresses in a QFN Plastic-Encapsulated Package IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2014, 4 (08): : 1303 - 1308
- [25] Plastic Molded Package Technology for MEMS Sensor Evolution of MEMS sensor package 2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 2014, : 371 - 375
- [28] The reliability of plastic ball grid array package 2ND 1998 IEMT/IMC SYMPOSIUM, 1998, : 35 - 39
- [29] A thermally enhanced plastic package with indented leadframe 47TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 1997 PROCEEDINGS, 1997, : 338 - 342
- [30] SOLDER PLATING OF PLASTIC PACKAGE IC DEVICES PLATING AND SURFACE FINISHING, 1987, 74 (09): : 59 - 59