HEAT SINK ANALYSIS FOR 2-TERMINAL CYLINDRICAL MICROWAVE-OSCILLATOR DEVICES

被引：1
|
作者：
BATCHELOR, AR
机构：
[1] Coventry University, School of Engineering, Electrical and Electronics Division, Coventry, CV1 5FB, Priory Street
来源：
MICROELECTRONICS JOURNAL | 1994年 / 25卷 / 01期
关键词：
D O I：
10.1016/0026-2692(94)90157-0
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A theoretical analysis to calculate the steady-state temperature distribution within a heat sink configuration, common to two-terminal semiconductor devices used as sources oi microwave power, is outlined. The analysis applies to any heat sink configuration provided that it can be modelled as one or more homogeneous solid cylinders mounted on a semi-infinite heat sink, where the heat nux incident on both laces of each cylinder is uniform over a given central circular region. Results are presented that show how the maximum temperature rise within the heat sink configuration depends upon the input heat nux and the dimensions of given heat sink materials.
引用
收藏
页码：33 / 40
页数：8
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