ETCH-BACK PLANARIZATION TECHNIQUE FOR MULTILEVEL METALLIZATION

被引:2
|
作者
MAYUMI, S [1 ]
FUJIWARA, K [1 ]
NISHIDA, S [1 ]
UEDA, S [1 ]
INOUE, M [1 ]
机构
[1] MATSUSHITA ELECTR CORP,DIV MEMORY,KYOTO 617,JAPAN
关键词
D O I
10.1143/JJAP.27.280
中图分类号
O59 [应用物理学];
学科分类号
摘要
引用
收藏
页码:280 / 286
页数:7
相关论文
共 50 条
  • [1] ETCH-BACK PLANARIZATION TECHNIQUE FOR MULTILEVEL METALLIZATION.
    Mayumi, Shuichi
    Fujiwara, Kazuo
    Nishida, Shuichi
    Ueda, Seiji
    Inoue, Morio
    Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes, 1988, 27 (02): : 280 - 286
  • [2] Planarization of GaN by the etch-back method
    Williams, Adrian D.
    Moustakas, Theodore D.
    GAN, AIN, INN AND RELATED MATERIALS, 2006, 892 : 363 - +
  • [3] Metal gate etch-back planarization technology
    孟令款
    殷华湘
    陈大鹏
    叶甜春
    Journal of Semiconductors, 2012, (03) : 114 - 117
  • [4] A MODEL FOR RIE DIELECTRIC ETCH-BACK PLANARIZATION
    SHEPELA, A
    SOLLER, B
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1987, 134 (03) : 714 - 719
  • [5] Metal gate etch-back planarization technology
    Meng Lingkuan
    Yin Huaxiang
    Chen Dapeng
    Ye Tianchun
    JOURNAL OF SEMICONDUCTORS, 2012, 33 (03)
  • [6] ETCH-BACK PLANARIZATION TECHNOLOGY FOR INTERCONNECTION OF STACKED STRUCTURE
    MITSUHASHI, K
    SHIOZAKI, K
    OHTAKE, K
    KOBA, M
    AWANE, K
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1987, 134 (03) : C120 - C120
  • [7] UNIFORM POLYMER COATING TECHNIQUE FOR AN ETCH-BACK PLANARIZATION PROCESS USING LOW-MOLECULAR WEIGHT POLYMERS
    GOKAN, H
    MUKAINARU, M
    ENDO, N
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1988, 135 (04) : 1019 - 1021
  • [8] TECHNIQUE FOR PLANARIZATION OF MULTILEVEL METALLIZATION FOR SEMICONDUCTOR DEVICES.
    Vossen Jr., John Louis
    RCA technical notes, 1984, (1348):
  • [9] A PLANARIZATION TECHNOLOGY USING A BIAS-DEPOSITED DIELECTRIC FILM AND AN ETCH-BACK PROCESS
    FUJII, S
    FUKUMOTO, M
    FUSE, G
    OHZONE, T
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1988, 35 (11) : 1829 - 1833
  • [10] PLANARIZATION PROCESSES FOR MULTILEVEL METALLIZATION
    SCHWARTZ, GC
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1988, 135 (08) : C360 - C360