SILICON MICROMACHINING FOR SENSOR APPLICATIONS

被引：2
|
作者：
RUDOLF, F
BERGQVIST, J
机构：
[1] CSEM - Centre Suisse d'electronique et de Microtechnique S.A.
来源：
MICROELECTRONIC ENGINEERING | 1991年 / 15卷 / 1-4期
关键词：
D O I：
10.1016/0167-9317(91)90251-8
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The capacitive silicon sensor technology is an example of how silicon micromachining can be applied to a family of sensors. Absolute pressure sensors, accelerometers, and microphones can be fabricated with basically the same technology. Its main elements are standard IC processing, silicon etching, and wafer bonding. Placed in a suitable microsystem development environment, bulk silicon micromachining is still a key technology for new and low cost sensors and actuators.
引用
收藏
页码：399 / 406
页数：8
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