Simulation of Binder Infiltration in Additive Manufacturing of Sand Molds

被引:3
|
作者
Erhard, Patricia [1 ]
Tanjavooru, Vivek Teja [2 ]
Hartmann, Christoph [1 ]
van den Bosch, Lucas [1 ]
Seidel, Alexander [2 ]
Volk, Wolfram [1 ,2 ]
Guenther, Daniel [1 ]
机构
[1] Fraunhofer Inst Casting Composite & Proc Technol I, Lichtenbergstr 15, D-85748 Garching, Germany
[2] Tech Univ Munich TUM, TUM Sch Engn & Design, Boltzmannstr 15, D-85748 Garching, Germany
关键词
additive manufacturing; binder infiltration; binder jetting; computational fluid dynamics simulation; sand molds; 3D printing;
D O I
10.1002/adem.202300212
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This article proposes a computational fluid dynamics approach to simulate binder infiltration in 3D printing of sand molds using OpenFOAM facilitating the identification of suitable levers for application-specific material and process developments. A method for randomly generating powder bulks of designated powder size distributions (PSD) and procedures for automated analysis of the infiltration profile and volume are introduced. Simulation is utilized to investigate binder infiltration using different droplet spacings, representing different printheads' resolutions. The apparent particle size at the exact location of the droplets' impact, the droplets' landing position in relation to the respective surface topography, and thus the statistical appearance of particle formations appear to be influencing the infiltration profile. High-speed camera observations show the plausibility of the predicted infiltration kinetics. An exemplary use case compares the predicted infiltration profiles to the compressive strength of specimens printed from silica sand with low binder contents. Simulation predicts an average infiltration of 250 mu m that presumably achieves reliable bonding for layer thicknesses up to 365 mu m. A decrease in strength with increasing layer thickness at constant binder contents can be found in the experiment - at layer thicknesses above 350 mu m, only minor strengths are achieved.
引用
收藏
页数:20
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