COMPUTERIZED THICK-FILM PRINTER

被引：1

作者：

KOLC, RF

机构：

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1980年 / 3卷 / 03期

关键词：

D O I：

10.1109/TCHMT.1980.1135634

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：327 / 330

页数：4

共 50 条

[1] DESCRIPTION OF A THICK-FILM THERMAL PRINTER
ANTES, A
[J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1972, 51 (09): : 728 - &
[2] COMPUTERIZED ANALYSIS OF BURST NOISE IN THICK-FILM RESISTORS
COTTLE, JG
CHEN, CTM
[J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1983, 6 (02): : 163 - 167
[3] AN INTRODUCTION TO THE NAVY MANUFACTURING TECHNOLOGY PROGRAM FOR COMPUTERIZED THICK-FILM PRINTING
ZARNOW, DF
[J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1980, 3 (03): : 315 - 327
[4] THICK-FILM TECHNOLOGY
PRUDENZIATI, M
[J]. SENSORS AND ACTUATORS A-PHYSICAL, 1991, 25 (1-3) : 227 - 234
[5] THICK-FILM CIRCUITS
ISERT, H
[J]. ELEKTROTECHNISCHE ZEITSCHRIFT B-AUSGABE, 1972, 24 (04): : 85 - &
[6] THICK-FILM TECHNOLOGY
OCONNELL, JA
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1967, 4 (05): : 331 - &
[7] THICK-FILM TECHNOLOGY
FUNK, W
[J]. PHILIPS TECHNICAL REVIEW, 1975, 35 (05): : 144 - 150
[8] Thick-film sensors
White, N
Turner, J
[J]. MEASUREMENT SCIENCE AND TECHNOLOGY, 1997, 8 (01) : U3 - U3
[9] THICK-FILM MICROCIRCUITS
不详
[J]. BATTELLE TECHNICAL REVIEW, 1968, 17 (08): : 26 - &
[10] THICK-FILM VARIANT
DILLINGHAM, RP
[J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1973, 52 (09): : 714 - 714