COPPER ELECTRODEPOSITION AND DISSOLUTION AT ELECTRODES MODIFIED IN ADVANCE WITH THIOUREA

被引:0
|
作者
KUZNETSOVA, LA
KOVARSKII, NY
机构
来源
RUSSIAN ELECTROCHEMISTRY | 1993年 / 29卷 / 02期
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中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
The cathodic and anodic behavior of copper electrodes modified in advance by immersion into an acidic sulfate copper bath with thiourea was studied in the same electrolyte without thiourea as well as in sulfuric acid solution. Two types of adsorbed film were found to be formed which had different inhibiting effects on copper electrodeposition and dissolution and on hydrogen ion discharge. The behavior of these films was studied, and suggestions as to their composition were made. It was found when using adsorbed layers which are lifted by the metal that without an incorporation of the additives into the deposits, the structure of the coatings is independent of overpotential.
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页码:307 / 313
页数:7
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