VACANCY COALESCENCE DEFECTS IN A COPPER-SILVER ALLOY

被引:0
|
作者
LEBLANC, P [1 ]
CONDAT, M [1 ]
FAYARD, M [1 ]
机构
[1] ECOLE NATL SUPER CHIM PARIS,LAB MET STRUCT ALLIAGES ORDONNES,EQUIPE RECH ASSOC 221,11 RUE PIERRE,75231 PARIS,FRANCE
关键词
D O I
暂无
中图分类号
Q5 [生物化学]; Q7 [分子生物学];
学科分类号
071010 ; 081704 ;
摘要
引用
收藏
页码:793 / 796
页数:4
相关论文
共 50 条
  • [1] Alloy of thorium with copper-silver and gold
    Raub, E
    Engel, M
    [J]. ZEITSCHRIFT FUR ELEKTROCHEMIE UND ANGEWANDTE PHYSIKALISCHE CHEMIE, 1943, 49 : 487 - 493
  • [2] Copper-Silver Alloy for Advanced Barrierless Metallization
    C. H. Lin
    W. K. Leau
    [J]. Journal of Electronic Materials, 2009, 38 : 2212 - 2221
  • [3] Copper-Silver Alloy for Advanced Barrierless Metallization
    Lin, C. H.
    Leau, W. K.
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2009, 38 (11) : 2212 - 2221
  • [4] Surface segregation in a dilute copper-silver alloy
    Bronner, S. W.
    Wynblatt, P.
    [J]. JOURNAL OF MATERIALS RESEARCH, 1986, 1 (05) : 646 - 651
  • [5] Improving the quality of strips made of a copper-silver alloy
    A. I. Snigirev
    L. M. Zheleznyak
    E. A. Shushakova
    [J]. Metallurgist, 2012, 56 : 546 - 550
  • [6] Performance of a copper-silver alloy as an EML conductor material
    Castro-Dettmer, Z
    Persad, C
    [J]. 2004 12TH SYMPOSIUM ON ELECTROMAGNETIC LAUNCH TECHNOLOGY, 2004, : 37 - 42
  • [7] Improving the quality of strips made of a copper-silver alloy
    Snigirev, A. I.
    Zheleznyak, L. M.
    Shushakova, E. A.
    [J]. METALLURGIST, 2012, 56 (7-8) : 546 - 550
  • [8] TENSILE DEFORMATION OF A 2-PHASE COPPER-SILVER ALLOY
    DURAND, L
    COULOMB, P
    [J]. SCRIPTA METALLURGICA, 1981, 15 (01): : 95 - 96
  • [9] Performance of a copper-silver alloy as an electromagnetic launcher conductor material
    Castro-Dettmer, Z
    Persad, C
    [J]. IEEE TRANSACTIONS ON MAGNETICS, 2005, 41 (01) : 176 - 181
  • [10] Obtainable microstructures in electrical conductors made of a copper-silver alloy
    Castro-Dettmer, Z
    Simmons, M
    Chadee, P
    [J]. IEEE TRANSACTIONS ON MAGNETICS, 2003, 39 (01) : 323 - 326