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- [5] Experimental Evaluations of the Strength of Silicon Die by 3-Point-Bend Versus Ball-on-Ring Tests IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2009, 32 (04): : 248 - 255
- [7] Experimental evaluations of the strength of silicon die by 3-point-bend versus Ball-on-Ring tests 2008 11TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOLS 1-3, 2008, : 687 - 694