VACUUM METALLIZATION OF POLYETHERIMIDE - INTERFACIAL CHEMISTRY AND ADHESION

被引：3
|
作者：
PORTA, GM
FOUST, DF
BURRELL, MC
KARAS, BR
机构：
[1] Ge Corporate Research and Development, Schenectady, New York
来源：
POLYMER ENGINEERING AND SCIENCE | 1992年 / 32卷 / 15期
关键词：
D O I：
10.1002/pen.760321507
中图分类号：
TQ [化学工业];
学科分类号：
0817 ;
摘要：
Vacuum deposition of metal coatings on polyetherimide was investigated. High levels of adhesion (> 170 g/mm) with evaporated copper were achieved through a primarily chemical interaction. Changes in the interfacial chemistry were correlated with metal/polymer adhesion. Vacuum deposition of aluminum onto polyetherimide was also examined and found to yield much lower adhesion.
引用
收藏
页码：1021 / 1027
页数：7
相关论文
共 50 条
  • [1] Relationship between interfacial adhesion and electromigration in Cu metallization
    Lane, MW
    Liniger, EG
    Lloyd, JR
    [J]. JOURNAL OF APPLIED PHYSICS, 2003, 93 (03) : 1417 - 1421
  • [2] Relationship between interfacial adhesion and electromigration in Cu metallization
    Lloyd, JR
    Lane, MW
    Liniger, EG
    [J]. 2002 IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP - FINAL REPORT, 2002, : 32 - 35
  • [3] CHARACTERIZATION OF SURFACE MODIFICATIONS DURING METALLIZATION OF POLYETHERIMIDE
    BURRELL, MC
    KARAS, BR
    FOUST, DF
    DUMAS, WV
    LAMBY, EJ
    CHERA, JJ
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1988, 135 (08) : C358 - C358
  • [4] INTERFACIAL CHEMISTRY AND ADHESION - RECENT DEVELOPMENTS AND PROSPECTS
    MITTAL, KL
    [J]. PURE AND APPLIED CHEMISTRY, 1980, 52 (05) : 1295 - 1305
  • [5] PAINT ADHESION, CORROSION PROTECTION, AND INTERFACIAL CHEMISTRY
    DICKIE, RA
    [J]. ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1992, 204 : 65 - PMSE
  • [6] PAINT ADHESION, CORROSION PROTECTION, AND INTERFACIAL CHEMISTRY
    DICKIE, RA
    [J]. PROGRESS IN ORGANIC COATINGS, 1994, 25 (01) : 3 - 22
  • [7] VACUUM METALLIZATION
    RIOU, R
    [J]. CORROSION TRAITEMENTS PROTECTION FINITION, 1973, 21 (03): : 170 - 171
  • [8] Impact of interfacial chemistry on adhesion and electromigration in Cu interconnects
    Zhou, Y
    Scherban, T
    Xu, GH
    He, J
    Miner, B
    Jan, CH
    Ott, A
    O'Loughlin, J
    Ingerly, D
    Leu, J
    [J]. ADVANCED METALLIZATION CONFERENCE 2004 (AMC 2004), 2004, : 189 - 199
  • [9] INTERFACIAL CHEMISTRY OF HUMIDITY-INDUCED ADHESION LOSS
    HOLUBKA, JW
    DEVRIES, JE
    DICKIE, RA
    [J]. INDUSTRIAL & ENGINEERING CHEMISTRY PRODUCT RESEARCH AND DEVELOPMENT, 1984, 23 (01): : 63 - 70
  • [10] VACUUM METALLIZATION OF PLASTICS
    TROMPLER, S
    [J]. KUNSTSTOFFE-GERMAN PLASTICS, 1988, 78 (06): : 490 - 491
12345