CURING BEHAVIOR OF CONDUCTING POLYMER COMPOSITE

被引：6
|
作者：
RADHAKRISHNAN, S
机构：
[1] Natl Chemical Lab, Poona, India, Natl Chemical Lab, Poona, India
来源：
JOURNAL OF MATERIALS SCIENCE LETTERS | 1987年 / 6卷 / 02期
关键词：
PHENOLIC RESINS - Reinforcing - PLASTICS - Electric Conductivity - THERMOSETS - Curing;
D O I：
10.1007/BF01728966
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Carbon-filled polymer composites are becoming increasingly important for electrical/electronic applications. The curing behaviour of an electrically conductive composite is reported. The polymer used was phenolic grade thermoset moulding compound filled with carbon black and silica.
引用
收藏
页码：145 / 148
页数：4
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