ANALYSIS OF SOLDERING PROCESS OF ELECTRONIC EQUIPMENT BY METHOD OF LIQUID SOLDER STANDING WAVE

被引：0
|
作者：
PIETRZYK.J [1 ]
机构：
[1] POLYTECH INST,WARSAW,POLAND
来源：
MECHANIK MIESIECZNIK NAUKOWO-TECHNICZNY | 1974年 / 47卷 / 01期
关键词：
D O I：
暂无
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
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页码：24 / 26
页数：3
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