STUDY ON THE MARKING PROCESSING OF IC PACKAGES BY YAG LASER

被引：0
|
作者：
TEZUKA, S
YOSHIKAWA, M
机构：
来源：
INTERNATIONAL JOURNAL OF THE JAPAN SOCIETY FOR PRECISION ENGINEERING | 1991年 / 25卷 / 04期
关键词：
LASER MARKING; YAG LASER; IC PACKAGE;
D O I：
暂无
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
引用
收藏
页码：297 / 298
页数：2
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