In the thin film transistor liquid crystal display (TFT-LCD) panel process, Gate(grid) layer and SD layer (source) circuit can use pure metal film layers according to the product requirements, such as molybdenum, copper and other metal film, can also use metal composite film layers such as aluminum molybdenum, aluminum neodymium molybdenum, molybdenum aluminum molybdenum metal composite film. When different metal or metal composite layers are used as Gate and SD circuits, different etchant should be applied. But in actual production, it is often an etchant which corresponds to the metal film layers or metal composite film layers. The molybdenum metal film layers etch rate is larger than the aluminum molybdenum composite film layers etch rate. When the aluminum molybdenum composite film etching complete, the profile is abnormal sometimes, such as film larger angle (80-900), top metal occurs tip or shrink phenomenon. When the macro defect occurs and the subsequent process will produce the corresponding optical defects or lead to residual material in the rear layer and affect the quality of products. In this paper, the factors affecting the profile of metal film layers or metal composite film layers are mainly affected by the etching process and exposure process. Through adjusting the etchant concentration, temperature, etching mode and exposure step to adjust the angle, the metal molybdenum occurrence probability of the metal film indentation is reduced, the slope angle of the metal film is controlled at 60, and the metal composite film slope angle is controlled at 50 so as to reduce the bad incidence and improve the product quality.
