The self-annealing of copper.

被引：0
|
作者：
Cook, M
Richards, TL
机构：
来源：
JOURNAL OF THE INSTITUTE OF METALS | 1944年 / 70卷
关键词：
D O I：
暂无
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
引用
收藏
页码：159 / 173
页数：21
相关论文
共 50 条
  • [1] The self-annealing phenomenon in copper interconnection
    Hara, T
    Toida, H
    Shimura, Y
    ELECTROCHEMICAL AND SOLID STATE LETTERS, 2003, 6 (07) : G98 - G100
  • [2] Self-annealing textures of copper damascene interconnects
    Lee, DN
    Lee, HJ
    RECRYSTALLIZATION AND GRAIN GROWTH, PTS 1 AND 2, 2004, 467-470 : 1333 - 1338
  • [3] Self-annealing characterization of electroplated copper films
    Lagrange, S
    Brongersma, SH
    Judelewicz, M
    Saerens, A
    Vervoort, I
    Richard, E
    Palmans, R
    Maex, K
    MICROELECTRONIC ENGINEERING, 2000, 50 (1-4) : 449 - 457
  • [4] Residual stress effect on self-annealing of electroplated copper
    Lee, CH
    Park, CO
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 2003, 42 (7A): : 4484 - 4488
  • [5] Residual stress effect on self-annealing of electroplated copper
    Lee, C.-H. (porthosv@chollian.net), 1600, Japan Society of Applied Physics (42):
  • [6] Kinetic mechanism of self-annealing in electroplated copper thin films
    Yang, HD
    Kim, CU
    ADVANCED METALLIZATION CONFERENCE 2000 (AMC 2000), 2001, : 187 - 191
  • [7] Room temperature self-annealing of electroplated and sputtered copper films
    Chen, M
    Rengarajan, S
    Hey, P
    Dordi, Y
    Zhang, H
    Hashim, I
    Ding, PJ
    Chin, B
    ADVANCED INTERCONNECTS AND CONTACTS, 1999, 564 : 413 - 420
  • [8] Room temperature self-annealing of electroplated and sputtered copper films
    Chen, M
    Rengarajan, S
    Hey, P
    Dordi, Y
    Zhang, H
    Hashim, I
    Ding, PJ
    Chin, B
    POLYCRYSTALLINE METAL AND MAGNETIC THIN FILMS, 1999, 562 : 249 - 256
  • [9] Interpretation of texture changes during self-annealing of electroplated copper
    Zhang, W. Q.
    Li, A. D.
    Ma, G. B.
    Yin, K. B.
    Xia, Y. D.
    Liu, Z. G.
    Chan, C. Y.
    Cheung, K. L.
    Bayes, M. W.
    Yee, K. W.
    MICROELECTRONIC ENGINEERING, 2010, 87 (12) : 2488 - 2494
  • [10] Crystallographic study on self-annealing of electroplated copper at room temperature
    Shinada, Eni
    Nagoshi, Takashi
    Chang, Tso-Fu Mark
    Sone, Masato
    MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2013, 16 (03) : 633 - 639
12345