LUALO3-CE - A HIGH-DENSITY, HIGH-SPEED SCINTILLATOR FOR GAMMA-DETECTION

被引:84
|
作者
MOSES, WW
DERENZO, SE
FYODOROV, A
KORZHIK, M
GEKTIN, A
MINKOV, B
ASLANOV, V
机构
[1] MINSK NUCL PROBLEMS INST, MINSK, BELARUS
[2] KHARKOV SINGLE CRYSTALS INST, KHARKOV 310141, UKRAINE
[3] SCITEC, RI&NC, MINSK, BELARUS
基金
美国国家卫生研究院;
关键词
D O I
10.1109/23.467837
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We present measurements of the scintillation properties of cerium doped lutetium aluminum perovskite, LuAlO3:Ce, a new dense (p=8.34 g/cm(3)) inorganic scintillator. This material has a 511 keV interaction length and photoelectric fraction of 1.1 cm and 32% respectively, which are well suited to gamma ray detection. In powdered form with 0.5% cerium concentration, the scintillation light output is estimated to be 9,600 photons/MeV of deposited energy, the emission spectrum is a single peak centered at 390 nm, and the fluorescence lifetime is described by the sum of 3 exponential terms, with 60% of the light being emitted with a 11 ns decay time, 26% with a 28 ns decay time, and 13% with a 835 ns decay time. Single crystals contaminated with approximate to 10% lutetium aluminum garnet (Lu3Al5O12) have significantly altered scintillation properties. The light output is 26,000 photons/MeV (3.2 times that of EGO), but the decay time increases significantly (1% of the light is emitted with a 10 ns decay time, 15% with a 245 ns decay time, and 85% with a 2010 ns decay time) and the emission spectrum is dominated by a peak centered at 315 nm with a secondary peak centered at 500 nm. The short decay lifetime, high density, and reasonable light output of LuAlO3:Ce (the perovskite phase) suggest that it is useful for applications where high counting rates, good stopping power, good energy resolution, and fast timing are important. However, it is necessary to grow single crystals that are uncontaminated by the garnet phase to realize these properties.
引用
收藏
页码:275 / 279
页数:5
相关论文
共 50 条
  • [1] A compact, high-density gamma-detection module for Time-of-Flight measurements in PET applications
    Sacco, I.
    Dohle, R.
    Fischer, P.
    Piemonte, C.
    Ritzert, M.
    NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT, 2016, 824 : 233 - 236
  • [2] BICMOS, A TECHNOLOGY FOR HIGH-SPEED HIGH-DENSITY ICS
    KLOSE, H
    ZEHNER, B
    WIEDER, A
    PROCEEDINGS - IEEE INTERNATIONAL CONFERENCE ON COMPUTER DESIGN : VLSI IN COMPUTERS & PROCESSORS, 1989, : 304 - 309
  • [3] BICMOS, A TECHNOLOGY FOR HIGH-SPEED HIGH-DENSITY ICS
    ZEHNER, B
    KLOSE, H
    FEIGE, D
    WIEDER, A
    SIEMENS FORSCHUNGS-UND ENTWICKLUNGSBERICHTE-SIEMENS RESEARCH AND DEVELOPMENT REPORTS, 1988, 17 (06): : 278 - 283
  • [4] BICMOS, a technology for high-speed/high-density ICs
    Zehner, Bernd
    Klose, Helmut
    Wieder, Armin
    Feige, Dieter
    Siemens Forschungs- und Entwicklungsberichte/Siemens Research and Development Reports, 1988, 17 (06): : 278 - 283
  • [5] Design of high-density interconnects for high-speed transmission
    Fu, Wanlin
    Kimura, Makoto
    Okada, Kenichi
    Sakai, Jun
    Masu, Kazuya
    57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 352 - +
  • [6] HIGH-SPEED HIGH-DENSITY CONTROL STORE.
    Creamer, M.K.
    IBM Technical Disclosure Bulletin, 1976, 18 (08): : 2478 - 2486
  • [7] The Electrical Design of High-speed and High-density ASIC Package
    Tao, Wenjun
    Li, Jun
    Zhou, Yunyan
    Wang, Qidong
    Cao, Liqiang
    Guidotti, Daniel
    Wan, Lixi
    2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 497 - 499
  • [8] HIGH-DENSITY PACKAGING TECHNIQUE FOR HIGH-SPEED MILITARY COMPUTERS
    TOLLEY, GE
    TIPTON, RW
    IEEE SPECTRUM, 1965, 2 (03) : 82 - &
  • [9] DESIGN OF HIGH-SPEED, HIGH-DENSITY CNNS IN CMOS TECHNOLOGY
    CRUZ, JM
    CHUA, LO
    INTERNATIONAL JOURNAL OF CIRCUIT THEORY AND APPLICATIONS, 1992, 20 (05) : 555 - 572
  • [10] Quilt packaging: High-density, high-speed interchip communications
    Bernstein, Gary H.
    Liu, Qing
    Yan, Minjun
    Sun, Zhuowen
    Kopp, David
    Porod, Wolfgang
    Snider, Greg
    Fay, Patrick
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2007, 30 (04): : 731 - 740