NEW METHOD IN FABRICATION OF TANTALUM THIN-FILM INTEGRATED CIRCUITS

被引：0
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作者：
MIWA, I
NISHIMURA, T
机构：
来源：
IEEE TRANSACTIONS ON PARTS MATERIALS AND PACKAGING | 1965年 / PMP1卷 / 01期
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T [工业技术];
学科分类号：
08 ;
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页码：S285 / +
页数：1
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