A WAFER-SCALE DIGITAL INTEGRATOR USING RESTRUCTURABLE VLSI

被引：0
|
作者：
RAFFEL, JI
ANDERSON, AH
CHAPMAN, GH
KONKLE, KH
MATHUR, B
SOARES, AM
WYATT, PW
机构：
[1] MIT Lincoln Lab, Lexington, MA, USA, MIT Lincoln Lab, Lexington, MA, USA
来源：
IEEE JOURNAL OF SOLID-STATE CIRCUITS | 1985年 / 20卷 / 01期
关键词：
LASER BEAMS - Applications - LOGIC DEVICES;
D O I：
10.1109/JSSC.1985.1052320
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Wafer-scale integration has been demonstrated by fabricating a digital integrator on a monolithic 20-cm**2 silicon chip, the first laser-restructured digital logic system. Large-area integration is accomplished by laser-programming of metal interconnect for defect avoidance. The authors describe the technology for laser welding and cutting, the design methodology and CAD tools developed for wafer-scale integration, and the integrator itself.
引用
收藏
页码：399 / 406
页数：8
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