REPRESENTATION OF THERMAL-BEHAVIOR OF ELECTRONIC COMPONENTS FOR THE CREATION OF A DATA-BANK

The thermal characteristics of currently available integrated circuit packages are not satisfactory. In order to remedy the lack of information, a databank is being set up at the Centre National d'Etudes des Telecommunications (CNET, France Telecom Research Centre). This paper presents the results of studies conducted to determine the principles governing the establishment of this databank, including the selection of a thermal modeling approach, the effects of the main parameters, and the choice of nominal package values.